Description
Specification:
Features
● High speed up to 3200MHz
● Transfer bandwidth up to 25.6GB/s
● Energy efficient: saves 20% power compared to DDR3
● 8-layer PCB provides improved signal transfer and
system stability
● Supports Intel® Core™ 8th/9th/10th series and
AMD® ZEN 2nd 3rd Ryzen™ series※
● Module: 288-pin DIMM
● Densities: 8GB / 16GB / 32GB
● Power supply: VDD and VDDQ=1.2V +0.06/-0.06V
● DRAM activation power supply:
VPP = 2.5V (+0.25V / -0.125V)
● DRAM VCC: DDR4 STD 1.2V
● Operating temperature: 0°C to 85°C
Features
● High speed up to 3200MHz
● Transfer bandwidth up to 25.6GB/s
● Energy efficient: saves 20% power compared to DDR3
● 8-layer PCB provides improved signal transfer and
system stability
● Supports Intel® Core™ 8th/9th/10th series and
AMD® ZEN 2nd 3rd Ryzen™ series※
● Module: 288-pin DIMM
● Densities: 8GB / 16GB / 32GB
● Power supply: VDD and VDDQ=1.2V +0.06/-0.06V
● DRAM activation power supply:
VPP = 2.5V (+0.25V / -0.125V)
● DRAM VCC: DDR4 STD 1.2V
● Operating temperature: 0°C to 85°C