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Description
Specification:
Features ● High speed up to 3200MHz ● Transfer bandwidth up to 25.6GB/s ● Energy efficient: saves 20% power compared to DDR3 ● 8-layer PCB provides improved signal transfer and system stability ● Supports Intel® Core™ 8th/9th/10th series and AMD® ZEN 2nd 3rd Ryzen™ series※
● Module: 288-pin DIMM ● Densities: 8GB / 16GB / 32GB ● Power supply: VDD and VDDQ=1.2V +0.06/-0.06V ● DRAM activation power supply: VPP = 2.5V (+0.25V / -0.125V) ● DRAM VCC: DDR4 STD 1.2V ● Operating temperature: 0°C to 85°C